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4H-SiC BJT characterization at high current high voltage

机译:大电流高压下的4H-SiC BJT表征

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A model that can perfectly describe the experiment results was developed. Based on the model, detailed analysis showed that the defect at the Base-Emitter epi-interface is the key factor that limits today's SiC BJT gain. The effect of emitter size also can be studied for SiC BJT. 1200V SiC BJT under study can operate at bus voltage as high as 700V. Until now, no such characterization has been made. In this paper, static and switching characteristics of 1200V SiC BJT at high current and high voltage are reported for the first time. The common emitter output characteristics with current up to 28A (1244A/cm) and the dynamic characteristics at a bus voltage of 700V and high load current were obtained. Turn off loss and turn off time as the function of turn off current was recorded, which showed that the turn off loss of SiC BJT is much smaller than Si IGBT. Experiments showed an extremely large RBSOA of SiC BJT. With zero voltage base drive, the SiC BJT can successfully turn off 2.7 MW/cm power density. No second breakdown was observed which is the most unattractive aspect of Si BJT. All these experiments prove that, unlike Si BJT, SiC BJT is a good competitor to Si IGBT.
机译:开发了可以完美描述实验结果的模型。基于该模型,详细分析表明,基极-发射极外延界面的缺陷是限制当今SiC BJT增益的关键因素。 SiC BJT也可以研究发射极尺寸的影响。研究中的1200V SiC BJT可以在高达700V的总线电压下工作。到目前为止,还没有这种表征。本文首次报道了1200V SiC BJT在大电流和高电压下的静态和开关特性。获得了电流高达28A(1244A / cm)的常见发射极输出特性,以及在总线电压为700V和高负载电流时的动态特性。记录了关断损耗和关断时间作为关断电流的函数,这表明SiC BJT的关断损耗比Si IGBT小得多。实验表明,SiC BJT的RBSOA非常大。通过零电压基极驱动,SiC BJT可以成功关闭2.7 MW / cm的功率密度。没有观察到二次击穿,这是Si BJT最没有吸引力的方面。所有这些实验证明,与Si BJT不同,SiC BJT是Si IGBT的良好竞争者。

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