As consumer demand for smaller, more compact electronic products grows, electronics manufacturing services (EMS) companies and their OEM partners are challenged with constantly qualifying and quickly deploying evolving packaging technologies. Flip-chip packaging is one of the technologies that is gaining acceptance as a viable option for many manufacturing operations. Traditionally viewed as a technology that was big on promise but lacking in practical application, flip chip has undergone significant industry advances, including more flexible use of underfill materials, and now offers significant cost, time and labor savings. This paper will demonstrate one strategy for qualifying and deploying flip chip technology. It will explore the challenges of integrating an advanced technology into standard SMT lines, including the development of effective test methods to ensure product quality and performance. The paper will also discuss options that can provide tangible benefits delivered to the customer with flip-chip technology and will offer insight and recommendations for developing a flip-chip roadmap.
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