Solder Extrusions and Underfill Delaminations: a remarkable Flip chip Qualification Experience

摘要

The last years have witnessed an explosive growing demand for all those electronic products, which can be jointly referred to as "mobile electronics". To fulfill such a development rate in the worldwide market, the smaller, cheaper and faster philosophy in the microelectronics packaging industry needs to be pursued with ever increasing efforts. The most suitable packaging solution from this standpoint is mostly identified as the Flip Chip connection technology. In this environ- Ment, the Celestica Italia Packaging and Technology Development Group performed a qualification run on Multichip Module Lami- Nates (MCM-Ls).