Package Contracted with Fine Pitch IVH for High Pin Count Chip Attachment

摘要

In order to achieve high-density trace integration in a package, a new structure package fabricated with all the layers utilizing fine pitch IVH(Interstitial Via Hole) was investigated. The core of the package is made from aromatic polyamide film sandwiched with an epoxy resin as adhesive for dielectrics. CTE(Coefficient of Thermal Expansion) control was achieved by selecting a proper thickness of the polyamide film. Each layer with vias filled by copper plating was simultaneously stacked and connected by a lead free solder with hot vacuum press.