Packaging alternatives for high lead count, fine pitch, surface mount technology

摘要

It is noted that increasing demand for more powerful, small-form-factor personal computers is driving the need for highly integrated, high-performance, high-density, and low-cost component packaging, and that surface mount technology (SMT) has proved effective in meeting these needs. At the same time component technology is being relied upon to deliver high integration and high performance. While the future direction for packaged surface mount components seems clearly dominated by plastic encapsulation, there are a number of options using direct attachment of unpackaged die that achieve greater system density. The authors review both the alternatives and issues associated with the growing number of fine pitch surface mount and direct attach technologies that seem applicable for assembly of high-lead-count, high-integration IC devices.