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SURFACE MOUNTING TYPE SEMICONDUCTOR PACKAGE CAPABLE OF SHORTENING LEAD TIME, AND A SEMICONDUCTOR PACKAGE MANUFACTURING SYSTEM FOR A SURFACE MOUNTING TECHNOLOGY AND A METHOD THEREOF
SURFACE MOUNTING TYPE SEMICONDUCTOR PACKAGE CAPABLE OF SHORTENING LEAD TIME, AND A SEMICONDUCTOR PACKAGE MANUFACTURING SYSTEM FOR A SURFACE MOUNTING TECHNOLOGY AND A METHOD THEREOF
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机译:能够缩短交货时间的表面安装型半导体封装及其表面安装技术的半导体封装制造系统及其方法
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摘要
PURPOSE: A surface mounting type semiconductor package, and a semiconductor package manufacturing system for a surface mounting technology and a method thereof are provided to bond a lid with a substrate, thereby increasing production efficiency. ;CONSTITUTION: A semiconductor device(150) is mounted on a flat substrate(110). A lid(130) has a cap shape. The lid covers the semiconductor device. The lid includes a concave part(131) which covers a bonding unit(133) and the semiconductor device. The concave part of the lid is closely to the semiconductor device. The bonding unit is bonded with a bonding surface(111) of the substrate.;COPYRIGHT KIPO 2011
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