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Thermal fatigue strength estimation of solder joints of surface mount IC packages. 2nd Report; Comparison of three types of leads.

机译：表面安装型IC封装焊点的热疲劳强度估计。第二次报告;比较三种铅。

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Makoto KITANO; Sueo KAWAI; Ichio SHIMIZU;
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年度 1990
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专利

1. Evaluation of Fatigue Life in Microelectronics Solder Joints of a Surface-Mounted Type [J] . K. Kaminishi, M. Iino, M. Taneda Key Engineering Materials . 1998,第Pt2期

机译：表面安装型微电子焊点的疲劳寿命评估
2. Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBGA solder joints in a surface mount package [J] . Bor Zen Hong, Burrell L.G. IEEE transactions on components, packaging, and manufacturing technology. Part A . 1997,第3期

机译：模拟表面贴装封装中CBGA焊点的热致粘塑性变形和低周疲劳
3. Evaluation of Fatigue Crack Initiation and Extension Life in Microelectronics Solder Joints of Surface Mount Type [J] . Ken KAMINISHI, Makio IINO, Motoharu TANEDA JSME International Journal. Series A . 1999,第2期

机译：表面贴装型微电子焊点的疲劳裂纹萌生和延伸寿命的评估
4. Solder joint fatigue: comparison of hand soldering to vapor phase soldering on surface mounted components for aerospace applications [C] . Bevan, M.G., Charles, . 1994

机译：焊点疲劳：在航空航天应用的表面安装元件上手工焊接与气相焊接的比较
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. Thermal fatigue strength estimation of solder joints of surface mount IC packages. [O] . Makoto KITANO, Sueo KAWAI, Ichio SHIMIZU 1988

机译：表面安装型IC封装焊点的热疲劳强度估计。
8. Embrittlement of surface mount solder joints by hot solder-dipped, gold-plated leads. [R] . Vianco, P. T. 1993

机译：表面贴装焊点通过热浸焊镀金引线脆化。

Thermal fatigue strength estimation of solder joints of surface mount IC packages. 2nd Report; Comparison of three types of leads.

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