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Apparatus to produce a multichip package module in which rough- pitch and fine-pitch chips are mounted on a board
Apparatus to produce a multichip package module in which rough- pitch and fine-pitch chips are mounted on a board
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机译:用于生产多芯片封装模块的设备,其中将粗间距和细间距芯片安装在板上
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摘要
In a method of production of a multichip package module, rough- pitch bare chips are positioned at first locations on a printed-circuit board, and the rough-pitch bare chips are temporarily attached to the board at the first locations. The rough-pitch bare chips are mounted on the board at the same time by applying heat and pressure to the rough- pitch bare chips simultaneously. A respective one of fine-pitch bare chips is positioned at a respective one of second locations on the board other than the first locations, and the respective one of the fine-pitch bare chips is mounted on the board by applying heat and pressure to the fine- pitch bare chips individually, in order to produce the multichip package module.
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