Strategies for realization of integrated microelectromechanical systems: On-board power, silicon circuitry, multichip modules.

摘要

Integrated MEMS (including signal processing/driving circuits and micromachined sensors/actuators in one small die) are of interest of the micromachining research community since they have a potential to possess higher functionality and reliability, yet can also possess higher manufacturability and lower cost than macroscopic counterparts. In this thesis, a novel power integrated MEMS and a different approach for the realization of a vertically-integrated MEMS were suggested, along with a demonstration example. A miniaturized amorphous silicon solar cell array was designed, fabricated, and characterized. A power integrated MEMS was made in hybrid fashion using the miniaturized solar cell array and a deflectable silicon mirror. Several core technologies, a LIGA-like electroplated metallic MEMS technique, planarization of the surface of the foundry circuit chip and low-cost substrates, and a theoretical/finite element model for understanding the mechanical and thermal behavior of deposited thin polymeric films in MCM-D, were developed. A 32 by 32 element micromachined mirror array was designed, fabricated, and characterized as a demonstration of the vertically integrated MEMS. This micromirror array has the potential to be used as a display.