MOUNTING STRUCTURE, REMOVING METHOD AND DEVICE FOR MULTICHIP MODULE, MULTICHIP MODULE AND ITS PRODUCING METHOD, AND METHOD OF REMOVING COMPONENT ON MULTICHIP MODULE

摘要

PROBLEM TO BE SOLVED: To facilitate the removal of a multichip module (MCM) from a printed board upon occurrence of a trouble.;SOLUTION: The printed board 1 mounting the MCM 2 is provided with a hole 7 for supplying hot air to a solder joint part 6 from the lower surface side. When the printed board 1 is removed for replacement upon occurrence of a trouble in the MCM 2, hot air is supplied through a pipe connected with the hole 7. The hot air is supplied to the upper surface side of the printed board 1 and discharged to the outer circumferential side of the MCM 2 through many solder joints 6. Consequently, solder at all solder joints 6 can be heated and fused efficiently. Furthermore, discharged hot air is sucked by means of a suction unit and a partition panel is arranged in order to prevent adverse effect of heat on other electronic components existing in the vicinity of the MCM 2 as much as possible.;COPYRIGHT: (C)2004,JPO&NCIPI