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The Effect of Number of Zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on Reliability in Microelectronics Packaging

机译：凸块冶金学（UBM）下化学镍浸金（ENIG）的锌化数目对微电子封装可靠性的影响

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《》|2006年|P.567-570|共4页
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Abdullah; S.H.; Ahmad; I.; Jalar; A.;
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1. The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition [J] . Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Microelectronics & Reliability . 2006,第2a4期

机译：化学镀镍沉金（ENIG）沉积中的凸块下冶金（UBM）的表面特性
2. Effects of Temperature-Humidity Treatment on Bending Reliability of Epoxy Sn-58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes [J] . Jeong Haksan, Lee Choong-Jae, Myung Woo-Ram, Science of advanced materials . 2020,第4期

机译：温湿处理对化学镀镍金（ENIG）和化学镀镍钯金（ENEPIG）表面处理的环氧树脂Sn-58Bi焊料弯曲可靠性的影响
3. Effects of Under Bump Metallurgy (UBM) Materials on the Corrosion of Electroless Nickel Films [J] . Yu Jin, Kim Kyoungdoc Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science . 2015,第7期

机译：凸块冶金（UBM）材料对化学镀镍膜腐蚀的影响
4. The Effect of Number of Zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on Reliability in Microelectronics Packaging [C] . Siti Hajar Abdullah, Ibrahim Ahmad, Azman Jalar International Conference on Microelectronics . 2006

机译：燃烧镍浸泡金（ENIG）在微电子包装的可靠性下电镀镍浸渍金（ENIG）数量的影响
5. Wetting behaviors and interfacial reactions of lead-containing and lead-free solder alloys on gold, palladium, nickel foils, leadframes, and under-bump thin film metallizations in electronic packaging. [D] . Kim, Patrick Gu-Ho. 1998

机译：含铅和无铅焊料合金在电子包装中的金，钯，镍箔，引线框架和凸块下的薄膜金属上的润湿行为和界面反应。
6. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [O] . Pan Yi, Kui Xiao, Kangkang Ding, 2017

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7. Corrosion Study of Electrodeposited Co-Ni-Fe Protective Coating on Electroless Nickel Immersion Gold (ENIG) Flexible Printed Circuit [O] . Hyie Koay Mei, Ahmad Athirah, Resali Nor Azrina, 2014

机译：化学镀镍浸金（ENIG）柔性印刷电路板上电沉积Co-Ni-Fe保护膜的腐蚀研究

The Effect of Number of Zincation in Electroless Nickel Immersion Gold (ENIG) Under Bump Metallurgy (UBM) on Reliability in Microelectronics Packaging

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