ELECTROLESS NICKEL SUBSTITUTED GOLD PLATING TREATMENT LAYER, ELECTROLESS NICKEL PLATING SOLUTION, AND ELECTROLESS NICKEL SUBSTITUTED GOLD PLATING TREATMENT METHOD

摘要

PROBLEM TO BE SOLVED: To provide an electroless nickel substituted gold plating treatment layer having high solder connection reliability, an electroless nickel plating solution, and electroless nickel substituted gold plating treatment method.;SOLUTION: The electroless nickel substituted gold plating treatment layer is obtained by subjecting the surface of a nickel plating layer of -560 mV or more in the oxidation reduction potential of its surface in an aqueous alkaline solution to the gold plating treatment. The electroless nickel plating solution used in the case of forming the nickel plating layer contains a nickel salt, a reducing agent, a complexing agent and a stabilizer as essential components. The electroless nickel substituted gold plating treatment method comprises forming the nickel plating layer of -560 mV or more in the oxidation reduction potential of its surface in the aqueous alkaline solution on a substrate to be plated, then subjecting the surface of the nickel plating layer to gold plating treatment.;COPYRIGHT: (C)2005,JPO&NCIPI