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Corrosion Study of Electrodeposited Co-Ni-Fe Protective Coating on Electroless Nickel Immersion Gold (ENIG) Flexible Printed Circuit

机译：化学镀镍浸金（ENIG）柔性印刷电路板上电沉积Co-Ni-Fe保护膜的腐蚀研究

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Hyie Koay Mei; Ahmad Athirah; Resali Nor Azrina; Munir Mohd Firdaus; Li Choong Soo; Saidin Sheridan;
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年度 2014
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1. Effects of Temperature-Humidity Treatment on Bending Reliability of Epoxy Sn-58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes [J] . Jeong Haksan, Lee Choong-Jae, Myung Woo-Ram, Science of advanced materials . 2020,第4期

机译：温湿处理对化学镀镍金（ENIG）和化学镀镍钯金（ENEPIG）表面处理的环氧树脂Sn-58Bi焊料弯曲可靠性的影响
2. Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards [J] . Kui Xiao, Pan Yi, Chaofang Dong, Materials Letters . 2018,第JANa1期

机译：模具在覆铜层压板和化学镀镍/浸金印刷电路板的电化学迁移中的作用
3. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [J] . Pan Yi, Kui Xiao, Kangkang Ding, Materials . 2017,第2期

机译：薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
4. Corrosion study of electrodeposited Co-Ni-Fe protective coating on Electroless Nickel Immersion Gold (ENIG) flexible printed circuit [C] . Koay Mei Hyie, Athirah Ahmad, Nor Azrina Resali International Conference on System-Integrated Intelligence . 2014

机译：电沉积镍浸渍金（ENIG）柔性印刷电路电沉积CO-NI-FE保护涂层的腐蚀研究
5. Investigation of the corrosion behaviour of electroless nickel-boron and nickel-phosphorus coatings in basic solutions. [D] . Dadvand, Nazila. 2002

机译：在碱性溶液中研究化学镀镍硼和镍磷涂层的腐蚀行为。
6. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [O] . Pan Yi, Kui Xiao, Kangkang Ding, 2017

机译：薄电解质层下覆铜箔层压板和化学镀镍/浸金印刷电路板的电化学迁移行为
7. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers [O] . Pan Yi, Kui Xiao, Kangkang Ding, 2017

机译：薄电解质层下铜包覆层压板和化学镀镍/浸金印刷电路板的电化学迁移行为

Corrosion Study of Electrodeposited Co-Ni-Fe Protective Coating on Electroless Nickel Immersion Gold (ENIG) Flexible Printed Circuit

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