首页> 外文会议>International Conference on Thin Film Physics and Applications; 20070925-28; Shanghai(CN) >Properties of Homoepitaxial 4H-SiC and Characteristics of Ti/4H-SiC Schottky Barrier Diodes
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Properties of Homoepitaxial 4H-SiC and Characteristics of Ti/4H-SiC Schottky Barrier Diodes

机译:同质外延4H-SiC的特性和Ti / 4H-SiC肖特基势垒二极管的特性

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This paper describes the properties of the homoepitaxial 4H-SiC layer, the fabrication and electrical parameters of Ti/4H-SiC Schottky barrier diode (SBD). The 4H-SiC epitaxial layers, grown on the commercially available 8°off-oriented Si-face(0001) single-crystal 4H-SiC wafers, have been performed at 1550~1600℃ by using the step controlled epitaxy with low pressure chemical vapor deposition. X-ray diffraction measurement result indicates the single crystal nature of the epilayer, and Raman spectrum shows the typical 4H-SiC feature peaks. When the off-oriented angle of substrate is 8°, the epitaxial growth perfectly replicates the substrate's polytype. High quality 4H-SiC epilayer has been generated on the 4H-SiC substrate. Ti/4H-SiC SBDs with blocking voltage 1kV have been made on an undoped epilayer with 12um in thick and 3×10~(15)cm~(-3) in carrier density. The ideality factor n=1.16 and the effective barrier height φ_e=0.9V of the Ti/4H-SiC SBDs are measured with method of forward density-voltage (J-V). The diode rectification ratio of forward to reverse (defined at ±1V) is over 10~7 at room temperature. By using B~+ implantation, an amorphous layer as the edge termination is formed. The SBDs have on-state current density of 200A/cm~2 at a forward voltage drop of about 2V. The specific on-resistance for the rectifier is found to be as 6.6mΩ·cm~2.
机译:本文介绍了同质外延4H-SiC层的特性,Ti / 4H-SiC肖特基势垒二极管(SBD)的制备和电学参数。在1550〜1600℃的条件下,采用低压化学气相生长的台阶控制外延工艺,在市售8°off取向Si-face(0001)单晶4H-SiC晶片上生长4H-SiC外延层。沉积。 X射线衍射测量结果表明外延层的单晶性质,拉曼光谱显示出典型的4H-SiC特征峰。当基材的偏离取向角度为8°时,外延生长会完美地复制基材的多型体。在4H-SiC衬底上已经生成了高质量的4H-SiC外延层。在未掺杂的外延层上制备了阻挡电压为1kV的Ti / 4H-SiC SBD,其厚度为12um,载流子密度为3×10〜(15)cm〜(-3)。 Ti / 4H-SiC SBD的理想因子n = 1.16和有效势垒高度φ_e= 0.9V采用正向密度电压(J-V)方法进行测量。在室温下,正反二极管的整流比(定义为±1V)超过10〜7。通过使用B +注入,形成非晶层作为边缘终端。在大约2V的正向压降下,SBD的导通状态电流密度为200A / cm〜2。整流器的导通电阻为6.6mΩ·cm〜2。

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