Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

摘要

This paper describes the modeling approach and numerical results of MCM transmission lines formed by interwoven metallization patterns. The impedance of the signal traces is calculated based on quasistatic field approximations. The differences between conventional microstrip and interwoven transmission lines are pointed out and ample data are provided for the "weaved" line as a function of several geometrical parameters.