首页>外文会议>其他>IEEE Electronic Components & Technology Conference

IEEE Electronic Components & Technology Conference

召开年：
召开地：
出版时间：-

会议文集：-

会议论文

热门论文

全部论文

全选（0）

1.Relationship between initial thermal characteristics and lifetime projection of semiconductor laser diodes

机译：半导体激光二极管初始热特性与寿命投影的关系
- 作者：Nam Hwang;Sang-Hwan Lee;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
2.A novel flip chip technology using non-conductive resin sheet

机译：一种使用非导电树脂片的新型倒装芯片技术
- 作者：Ito S.;Mizutani M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
3.Low cost MCM-L fiber-optic transmitter package

机译：低成本MCM-L光纤发射机包
- 作者：Kellzi H.G.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
4.Evaluation of solder joint reliability between PWB and CSP by using high TCE ceramic material

机译：使用高TCE陶瓷材料评估PWB和CSP之间的焊接接头可靠性
- 作者：Yonekura H.;Higashi M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
5.Pad redistribution technology for flip chip applications

机译：用于倒装芯片应用的焊盘再分配技术
- 作者：Tsui C.C.;Huang Y.W.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
6.A cost effective ceramic package for LD/PD module in subscriber system

机译：订户系统中LD / PD模块的经济高效陶瓷包
- 作者：Yanagisawa M.;Tomie S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
7.Investigations on popcorn cracking of T-QFP packages

机译：T-QFP包装爆米花裂缝的调查
- 作者：Dudek R.;Sommer P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
8.Known good die, die replacement (rework), and their influences on multichip module costs

机译：已知的好死，模具更换（返工），以及它们对多芯片模块成本的影响
- 作者：Petek J.M.;Charles H.K. Jr.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
9.Automatic power control of a VCSEL using an angled lid TO56 package

机译：使用Angled Lid To56封装自动控制VCSEL的电源控制
- 作者：Claisse P.R.;Jiang W.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
10.High performance, low-cost chip-on-board (COB) FDDI transmitter and receiver for avionics applications

机译：高性能，低成本芯片板（COB）FDDI发射器和接收器，用于航空电子应用
- 作者：Chan E.Y.;Le Q.N.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
11.High density organic flip chip package substrate technology

机译：高密度有机倒装芯片封装衬底技术
- 作者：Petefish W.G.;Noddin D.B.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
12.Photonics for the space environment

机译：空间环境的光子学
- 作者：Nagarajan R.;Li B.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
13.Fracture of optical fibers in connectors

机译：连接器中的光纤骨折
- 作者：Sidbury C.K.;Lefevre B.G.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
14.ORMOCERs/sup TM/-new photo-patternable dielectric and optical materials for MCM-packaging

机译：ORMOCERS / SUP TM / -NEW光学可图形的电介质和光学材料，用于MCM包装
- 作者：Popall M.;Dabek A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
15.Study on the method of reliability predication for contacts

机译：接触可靠性预测方法的研究
- 作者：Li Kui;Li Zhigang;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
16.Load resistor effect on intermodulation distortion in CATV PINs

机译：CATV引脚中的互调失真的负载电阻效果
- 作者：Wang H.S.;Jaing C.-L.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
17.Design, simulation and technological realization of a reliable packaging concept for high power laser bars

机译：高功率激光棒可靠包装概念的设计，仿真和技术实现
- 作者：Weiss S.;Kaulfersch E.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
18.Epoxy-based aqueous-processable photodielectric dry film and conductive ViaPlug for PCB build-up and IC packaging

机译：基于环氧树脂的水性加工光电干膜和PCB堆积和IC包装的导电通杆
- 作者：Gonzalez C.G.;Wessel R.A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
19.Methodology for screening high performance underfill materials

机译：用于筛选高性能底部填充材料的方法
- 作者：Hoang L.;Murphy A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
20.Improvements and recent advances in nanocomposite capacitors using a colloidal technique

机译：使用胶体技术的纳米复合材料电容器的改进和最近进步
- 作者：Agarwal V.;Chahal P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
21.RF flip-module BGA package

机译：RF翻转模块BGA包装
- 作者：Low Y.L.;Degani Y.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
22.O/e-MCM packaging with new, patternable dielectric and optical materials

机译：O / E-MCM包装，具有新的可绘制介电和光学材料
- 作者：Robertsson M.E.;Hagel O.-J.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
23.Integrated flow-thermomechanical and reliability analysis of a low air cooled flip chip-PBGA package

机译：低空气冷却倒装芯片PBGA包装的集成流动热机械和可靠性分析
- 作者：Bor Zen Hong;Tsorng-Dih Yuan;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
24.Development of ball bump forming technology using solder paste and new simplified CSP

机译：使用焊膏和新的简化CSP开发球凸块形成技术
- 作者：Fujino J.;Takaki S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
25.Real-time warpage measurement of electronic components with variable sensitivity

机译：具有可变灵敏度的电子元件的实时翘曲测量
- 作者：Verma K.;Columbus D.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
26.Author Index

机译：作者索引
- 作者：Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
27.Electrical modeling of the chip scale BGA

机译：电气建模芯片秤BGA
- 作者：Caggiano M.F.;Brush R.M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
28.Optimal oxidation control for enhancement of copper lead frame-EMC adhesion in packaging process

机译：用于增强铜引线框架EMC粘附性封装过程中的最佳氧化控制
- 作者：Byung Hoon Moon;Hee Yeoul Yoo;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
29.Transient heat conduction analysis of electronic packages by coupled boundary and finite element methods

机译：耦合边界和有限元方法电子封装的瞬态热传导分析
- 作者：Guven I.;Madenci E.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
30.Hybrid integrated silicon optical bench planar lightguide circuits

机译：混合集成硅光凳平面光导电路
- 作者：Gates J.;Muehlner D.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
31.New high-density multilayer technology on PCB

机译：PCB上的新型高密度多层技术
- 作者：Shimoto T.;Matsui K.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
32.Smart packages and interconnect substrates-computing functions using signal line coupling

机译：智能封装和互连基板计算功能使用信号线耦合
- 作者：Lipeng Cao;Krusius J.P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
33.Effective elastic modulus of underfill material for flip-chip applications

机译：用于倒装芯片应用的底部填充材料的有效弹性模量
- 作者：Jianmin Qu;Wong C.P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
34.Reliability study of an epoxy-bonded laser-to-fiber assembly

机译：环氧键合激光至纤维组件的可靠性研究
- 作者：Wu D.;Lee Y.C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
35.Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging

机译：电子互连和包装领域课程，研究和原型设施的发展教育项目
- 作者：Illyefalvi-Vitez Z.;Harsanyi G.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
36.Electroplated hermetic fiber

机译：电镀密封纤维
- 作者：Chen S.M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
37.Nonlinear mechanical modeling of electrical connectors using simple numerical methods and secant modulus data

机译：使用简单数值方法和SECANT模量数据的电连接器非线性机械建模
- 作者：Johnson J.L.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
38.MCM structures with poled dielectrics to improve testability

机译：MCM结构具有极化电介质以提高可测试性
- 作者：Mechtel D.M.;Charles H.K. Jr.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
39.Adhesives for optical devices

机译：光学器件的粘合剂
- 作者：Murata N.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
40.Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect

机译：用于板和背板光学互连的塑料VCSEL阵列包装和高密度聚合物波导
- 作者：Liu Y.S.;Wojnarowski R.J.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
41.Packaging for a 40-channel parallel optical interconnection module with an over 25-Gb/s throughput

机译：用于40通道并联光互连模块，具有超过25 GB / s吞吐量
- 作者：Katsura K.;Usui M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
42.A compact optical active connector: An optical interconnect module with an electrical connector interface

机译：紧凑型光学有源连接器：具有电连接器接口的光学互连模块
- 作者：Sasaki S.;Ando Y.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
43.Interconnection line structures on MCM-Si for giga-hertz quasi-TEM signal transmission

机译：GIGA-HERTZ准TEM信号传输MCM-SI互连线结构
- 作者：Woonghwan Ryu;Hyungsoo Kim;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
44.The execution of aggressive PBGA substrate yield learning in an existing PWB facility

机译：在现有PWB设施中执行侵略性的PBGA衬底产量学习
- 作者：Fuller J.W. Jr.;Norton E.M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
45.Flip chip equipment for high end electro-optical modules

机译：高端电光模块的翻转芯片设备
- 作者：Cooper K.A.;Yang R.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
46.Flip-chip bonding on 6-/spl mu/m pitch using thin-film microspring technology

机译：使用薄膜微粒技术在6- / SPL MU / M间距上倒装芯片粘合
- 作者：Smith D.L.;Fork D.K.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
47.Tacky Dots/sup TM/ technology for flip chip and BGA solder bumping

机译：用于倒装芯片和BGA焊料凸起的粘性点/ SUP TM /技术
- 作者：Beikmohamadi A.;Cairncross A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
48.Thermal dissipation analysis in flip chip on board and chip on board assemblies

机译：载芯片和芯片组件上的倒装芯片的热耗散分析
- 作者：Baldwin D.F.;Beerensson J.T.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
49.Surface treatment of copper for the adhesion improvement to epoxy mold compounds

机译：铜表面处理铜对环氧树脂化合物的粘附性改善
- 作者：Cui C.Q.;Tay H.L.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
50.High reliability, high density, low cost packaging systems for matrix BGA and CSP using VPES (vacuum printing encapsulation systems)

机译：使用VPES的矩阵BGA和CSP的高可靠性，高密度，低成本包装系统（真空印刷封装系统）
- 作者：Okuno A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
51.In package micro-aligner for fiber-optic packaging

机译：在封装微量对准器中，用于光纤包装
- 作者：Haake J.M.;Beranek M.W.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
52.Modern technologies of SMT require a high level of ability and know-how of engineers, technicians and employees

机译：SMT的现代技术需要高度的能力和专业知识，技术人员和员工
- 作者：Detert M.;Zerna T.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
53.Ceramic ball grid array for AMD K6 microprocessor application

机译：AMD K6微处理器应用的陶瓷球栅格阵列
- 作者：Master R.N.;Dolbear T.P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
54.Solder joint fatigue life of fleXBGA/sup TM/ assemblies

机译：FlexBGA / SUP TM /组件的焊接关节疲劳寿命
- 作者：Darveaux R.;Mawer A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
55.A study of a new flip chip packaging process for diversified bump and land combination

机译：一种新的多元化凸起和陆地组合的倒装芯片包装工艺的研究
- 作者：Mizutani M.;Ito S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
56.Quantitative evaluation of passive-aligned laser diode-to-fiber coupling

机译：无源对准激光二极管与光纤耦合的定量评估
- 作者：Lee S.H.;Joo G.C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
57.High performance VCSEL arrays for optical interconnection

机译：用于光学互连的高性能VCSEL阵列
- 作者：Schnitzer P.;Grabherr M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
58.Technical evaluation of a near chip scale size flip chip/plastic ball grid array package

机译：近芯片尺度尺寸倒装芯片/塑料球栅阵套装技术评价
- 作者：Jimarez M.;Li Li;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
59.Fluxless FC-soldering in O/sub 2/ purged ambient

机译：在O / SUB 2 /纯净的环境中焊接FC-SCC焊接
- 作者：Kuhmann J.F.;Pedersen E.H.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
60.A study of high density and reliability BGA package with solder ball lands of oval type

机译：椭圆型焊球焊球焊球焊球高密度可靠性BGA封装研究
- 作者：Kim S.J.;Lee C.H.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
61.Scaleable high power pump laser modules with high efficiency and high reliability

机译：具有高效率和高可靠性的可扩展大功率泵激光模块
- 作者：Huang S.Y.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
62.ASOC/sup TM/-a silicon-based integrated optical manufacturing technology

机译：ASOC / SUP TM / -A基于硅的集成光学制造技术
- 作者：Bestwick T.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
63.Board level reliability of CSP

机译：CSP的板级可靠性
- 作者：Juso H.;Yamaji Y.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
64.Probabilistic prediction of wireability and routing requirements for high density interconnect substrates

机译：高密度互连基板的无线性和布线要求的概率预测
- 作者：Diaz-Alvarez E.;Krusius J.P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
65.Proposed strategies for microelectronic packaging education for next generation engineers

机译：下一代工程师微电子包装教育的拟议策略
- 作者：Kim B.C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
66.Effects of on-chip and off-chip decoupling capacitors on electromagnetic radiated emission

机译：片上和片外离耦电容对电磁辐射发射的影响
- 作者：Jonghoon Kim;Hyungsoo Kim;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
67.Hybridly integrated optical transceiver module for access networks

机译：杂交集成的接入网络光收发器模块
- 作者：Uno T.;Nishikawa T.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
68.Modeling the power rails in leading edge microprocessor packages

机译：在前沿微处理器包中建模电源轨
- 作者：Michalka T.L.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
69.Influence of process variables on the reliability of microBGA/sup TM/ package assemblies

机译：过程变量对Microbga / Sup TM /包装组件可靠性的影响
- 作者：Partridge J.;Boysan P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
70.The development of a top-bottom-BGA (TB-BGA)

机译：开发顶级BGA（TB-BGA）
- 作者：Leutenbauer R.;Grosser V.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
71.Challenges in packaging a 4 chip FC MCM-L using KGD

机译：使用KGD包装4芯片FC MCM-L的挑战
- 作者：Adamjee W.;Corona C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
72.Comparison of advanced measurement and modeling techniques for electrical characterization of ball grid array packages

机译：高级测量和建模技术对球栅阵列封装的电力特性建模技术
- 作者：Horng T.S.;Tseng A.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
73.Economic and technical viability of integral passives

机译：整体自由度的经济和技术可行性
- 作者：Rector J.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
74.TMA, DMA, DSC, and TGA of lead free solders

机译：TMA，DMA，DSC和无铅焊料的TGA
- 作者：Lau J.H.;Chang C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
75.Electromagnetic analysis of high-density multi-chip module substrates having semi-custom interconnects

机译：具有半自定义互连的高密度多芯片模块基板的电磁分析
- 作者：Beker B.;Yee I.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
76.Comparison of the shear strength and reliability between gold-plated and bare copper lands of a BGA package

机译：BGA包装镀金与裸铜陆地剪切强度和可靠性的比较
- 作者：Lee C.H.;Lee S.G.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
77.A new family of ferruleless fiber-optic transceivers

机译：一个新的铁纤光纤收发器系列
- 作者：Guenter J.K.;Waltrip P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
78.Characterization of a no-flow underfill encapsulant during the solder reflow process

机译：焊料回流过程中无流量底部填充密封剂的表征
- 作者：Wong C.P.;Baldwin D.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
79.Constitutive and damage model for solders

机译：士兵的组成型和损伤模型
- 作者：Stolkarts V.;Moran B.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
80.Interconnect simulation using order reduction and scattering parameters

机译：使用顺序减少和散射参数互连模拟
- 作者：Beyene W.T.;Schutt-Aine J.E.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
81.Thermo-mechanical creep of two solder alloys

机译：两种焊料合金的热机械蠕变
- 作者：Wei Ren;Zhengfang Qian;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
82.Long wavelength transparent epoxy mold optical data link

机译：长波长透明环氧模具光学数据链路
- 作者：Tonai I.;Fukuoka T.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
83.Development of low cost, low temperature conductive adhesives

机译：低成本，低温导电粘合剂的发展
- 作者：Kang S.K.;Purushothaman S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
84.Thin film resistors and capacitors for multichip modules

机译：用于多芯片模块的薄膜电阻器和电容器
- 作者：Trigg A.;Ng Kin Keong;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
85.Multi-domain analysis of PBGA solder joints for structural design optimization

机译：PBGA焊点用于结构设计优化的多域分析
- 作者：Rassaian M.;Chang W.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
86.Low power consumption molded gigabit fiberoptic transceiver module

机译：低功耗模压千兆纤维收发器模块
- 作者：Go H.;Nishiyama N.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
87.Reliability studies of plastic ball grid array assemblies reflowed in nitrogen ambient

机译：氮气环境中回流塑料球栅阵列组件的可靠性研究
- 作者：Wu Y.P.;Chan Y.C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
88.Teaching electronics packaging using interactive multimedia

机译：使用互动多媒体教学电子产品包装
- 作者：May G.S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
89.Hermetic-equivalent packaging of GPS MCM-L modules for high reliability avionics applications

机译：高可靠性航空电子应用的GPS MCM-L模块的封闭式包装
- 作者：Hagge J.K.;Camilletti R.C.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
90.Analysis of delamination in IC packages using a new variable-order singular boundary element

机译：使用新的可变级奇异边界元素分析IC包中的分层
- 作者：Tay A.A.O.;Lee K.H.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
91.Development of 0.025 mm pitch anisotropic conductive film

机译：开发0.025mm间距各向异性导电膜
- 作者：Hotta Y.;Maeda M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
92.Reliability analysis for fine pitch BGA package

机译：精细间距BGA包装的可靠性分析
- 作者：Wu S.X.;Chin J.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
93.Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements

机译：使用断裂韧性和水热疲劳测量直接芯片附着组件的底部填充/钝化界面粘附性的表征
- 作者：Gurumurthy C.K.;Norris L.G.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
94.Hybrid optical switch using polymer waveguides and semiconductor optical amplifiers (SOAs)

机译：混合光开关使用聚合物波导和半导体光学放大器（SOA）
- 作者：Fan R.;Hooker R.B.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
95.A cost-effective assembly process for flip chips on FR-4

机译：FR-4上的翻转芯片的经济高效的装配过程
- 作者：Feustel F.;Lauterwald B.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
96.Unisolated 2.5 Gbit/s uncooled gain-coupled 1300 nm DFB lasers for low cost applications

机译：Unisolated 2.5 Gbit / s未加工的1300nm DFB激光器，用于低成本应用
- 作者：Ring W.S.;Smith I.S.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
97.Flip chip for AMD K6 microprocessor

机译：用于AMD K6微处理器的倒装芯片
- 作者：Master R.N.;Khan M.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
98.Novel thermally reworkable underfill encapsulants for flip-chip applications

机译：用于倒装芯片应用的新型热可重新加工底部填充剂
- 作者：Wang L.;Wong C.P.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
99.Packaging of VCSEL, MC-LED and detector 2-D arrays

机译：VCSEL的包装，MC LED和探测器2-D阵列
- 作者：Hall J.P.;Goodwin M.J.;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年
100.Visco-elastic-plastic properties and constitutive modeling of underfills

机译：粘弹性塑料特性和底部填充的本构型建模
- 作者：Zhengfang Qian;Jian Yang;Institute of Electric and Electronic Engineer
- 会议名称：《IEEE Electronic Components Technology Conference》 | 1998年