Thermal design and analysis of multi-chip LED module with ceramic substrate

摘要

In this paper, multi-chip LED modules with aluminum nitride (AIN), Al and aluminum oxide (Al_2O_3) based substrates were successfully designed, fabricated and investigated. Finite element method (FEM) and electrical test method were used to evaluate the thermal performance of LED modules. Both simulation and experimental results show that the module with AIN-based substrate exhibits better thermal performances than the two others. Moreover, AIN-based substrate LED module shows the best optical performances. The optical performances of the LED modules with different substrates not only verify that the optical output and degradation of LED has a direct relation with the input current, but also show that the degradation could begin earlier if the thermal dissipation is not managed well.