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3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections

机译：具有Cu / SnAg微凸点互连的3D TSV插入器技术

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来源
《Device packaging 2010 》|2010年|p.1-3|共3页
会议地点 Scottsdale/Fountain Hills AZ(US)
作者
Seung Wook Yoon; Dzafir Shariff; Jae Hun Ku; Pandi Chelvam Marimuthu; Flynn Carson;
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作者单位

Technology DivisionrnSTATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442rn*STATS ChipPAC Inc.47400 Kato Road Fremont, CA 94538 USArnSeungwook.yoon@statschppac.com;

Technology DivisionrnSTATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442rn*STATS ChipPAC Inc.47400 Kato Road Fremont, CA 94538 USA;

Technology DivisionrnSTATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442rn*STATS ChipPAC Inc.47400 Kato Road Fremont, CA 94538 USA;

Technology DivisionrnSTATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442rn*STATS ChipPAC Inc.47400 Kato Road Fremont, CA 94538 USA;

Technology DivisionrnSTATS ChipPAC Ltd. 5 Yishun Street 23, Singapore 768442rn*STATS ChipPAC Inc.47400 Kato Road Fremont, CA 94538 USA;

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会议组织
原文格式 PDF
正文语种 eng
中图分类制造工艺 ;
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专利

1. Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects [J] . Yu A., Lau J. H., Ho S. W., Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2011 ,第9期

机译：高长宽比TSV的制造以及用于具有高密度互连的Si中介层技术的细间距低成本焊锡微凸块的组装
2. Evaluation of Cu/SnAg microbump bonding processes for 3D integration using wafer-level underfill film [J] . Tsung-Fu Yang, Kuo-Shu Kao, Ren-Chin Cheng, Soldering & Surface Mount Technology . 2012 ,第4期

机译：使用晶圆级底部填充膜评估用于3D集成的Cu / SnAg微凸块结合工艺
3. Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis [J] . Che Fa Xing, Zhang Xiaowu, Lin Jong-Kai Microelectronics & Reliability . 2016 ,第JUNa期

机译：基于硅中介层（TSI）和无硅互连技术（SLIT）的3D IC封装可靠性研究
4. 3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections [C] . Seung Wook Yoon, Dzafir Shariff, Jae Hun Ku, International Conference and Exhibition on Device Packaging . 2010

机译：3D TSV插入器技术与CU / SNAG Microbump互连
5. Mechanical Reliability Challenges in Cu-Sn Microbump for 3D IC Packaging Technology. [D] . Wang, Yaodong. 2016

机译：用于3D IC封装技术的Cu-Sn微型凸块的机械可靠性挑战。
6. Inkjet printing technology for increasing the I/O density of 3D TSV interposers [O] . Behnam Khorramdel, Jessica Liljeholm, Mika-Matti Laurila, 2017

机译：喷墨打印技术用于提高3D TSV插入器的I / O密度
7. Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D TSV applications [O] . Sung Woo Ma, Jeong Hwan Lee, Jin Su Lee, 2016

机译：用于三维TsV应用的snag覆盖层制备的Cu到Cu接头的可靠性

3D TSV Interposer Technology with Cu/SnAg Microbump Interconnections

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