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MEMS/MOEMS failure location and characterization methods: The Micromirror Device

机译:MEMS / MOEMS故障定位和表征方法:微镜器件

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The purpose of this paper is to illustrate the approaches used to determine the location, character and origin of failed superstructure elements within the Digital Micromirror Device and relationally to other types of MEMS and MOEMS devices. Since the Digital Micromirror Device is a very large field of movable mirrors that are essentially identical in appearance, some of those methods will include the uses of: failure mapping, digital imaging techniques and explanations of precautions needed to ensure the result of the analysis is a correct answer to the questions asked. SUBJECT: The subject of this paper is to discuss the methods available to localize the failed location within a highly repetitive design matrix of reflective mirrors in an X/Y arrangement. OBJECTIVE: My objective is to show that several approaches are available to allow the failure analyst to isolate and document the failure locations within a large (Approximately 0.75 inches on a side) die area.
机译:本文的目的是说明用于确定数字微镜设备内以及与其他类型的MEMS和MOEMS设备相关的故障超结构元件的位置,特征和起源的方法。由于数字微镜设备是一个很大的可移动镜领域,它们在外观上基本相同,因此其中一些方法将包括以下用途:故障映射,数字成像技术以及确保分析结果准确无误的预防措施说明。正确回答所提问题。主题:本文的主题是讨论可用于在X / Y排列的反射镜的高度重复设计矩阵中定位故障位置的方法。目的:我的目标是证明可以使用几种方法来使故障分析人员隔离并记录较大(侧面约0.75英寸)模具区域内的故障位置。

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