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Relization of Strongly metal-dependent schottky barrier heights on n-GaAs by in situ electrochemical process

机译:通过原位电化学方法在an-GaAs上实现高度依赖金属的肖特基势垒高度

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Pt,Ni,Coand Sn Schottky barriers were formed on n-GaAs by an in situ electrochemical process which consists which consists of anodic etching and subsequent metal deposition n the same electrolyte.All the fabricated diodes showed nearly ideal thermionic emission transport.The Schottky barrier heights were found to be strongly dependent on the metal work function,giving a large value of slope factor of S=0.18-0.55.The result was far away from the recent prediction based on MIGS model.Based on SEM/AFM,XPS and Raman measurements,the result was explained by the DIGS model.
机译:Pt,Ni,Co和Sn Sn肖特基势垒是通过原位电化学过程在n-GaAs上形成的,该过程包括阳极刻蚀和随后在同一电解液中的金属沉积,所有制成的二极管都表现出近乎理想的热电子发射输运。发现高度高度依赖于金属功函数,具有较大的斜率因子S = 0.18-0.55。结果与基于MIGS模型的最新预测相去甚远。基于SEM / AFM,XPS和Raman测量,结果用DIGS模型解释。

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