Handset Design Techniques at the Package and System Level

摘要

Moving forward, semiconductor manufacturers can further integrate the various die in each of the two individual packages. Each package follows its own integration path, using the optimal mix of available product and process technologies. The ultimate goal is still the fully integrated single-chip phone, of course. But by combining silicon integration with advanced packaging strategies, handset designers get the most flexible and risk-free development roadmap possible, while still realizing a good portion of tomorrow's cost, power and space savings by integrating at the package level.