STMicroelectronics, 850 Rue Jean Monnet, Crolles, F-38920, France,CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France,LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;
CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France;
CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France;
CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France;
Canon Inc., 23-10 Kiyohara-Kogyodanchi, Utsunomiya city, 321-3298, Japan;
Canon Inc., 23-10 Kiyohara-Kogyodanchi, Utsunomiya city, 321-3298, Japan;
MAPPER Lithography, Computerlaan 15, 2628 XK Delft, The Netherlands;
LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;
LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;
LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;
E-beam resist; Outgassing; Contamination; Top coat; TD-GC-MS; QMS; XPS; FIB-SEM;
机译:多电子束光刻的抗脱气评估
机译:5 kV多电子束光刻:MAPPER工具和抗蚀剂工艺表征
机译:电子束光刻中绝缘抗蚀剂膜的非充电曝光条件研究
机译:电子束辐射下化学放大抗蚀剂脱气引起的光学系统含碳污染物的研究
机译:聚合物抗蚀剂的电子束感应电导率效应和电子束光刻中的电荷感应电子束偏转模拟。
机译:使用原位自显影抗蚀剂进行带反馈的电子束光刻
机译:过渡金属氧化物抵抗电子束和聚焦离子光谱光刻。