首页> 外文会议>Alternative lithographic technologies VI >Investigation of the resist outgassing and hydrocarbonaceous contamination induced in multi electron beams lithography tools
【24h】

Investigation of the resist outgassing and hydrocarbonaceous contamination induced in multi electron beams lithography tools

机译:多电子束光刻工具引起的抗蚀剂脱气和烃类污染的研究

获取原文
获取原文并翻译 | 示例

摘要

In emerging high-vacuum multi e-beams exposure tools, the release of hydrocarbonaceous species (precursor) by resists outgassing is unavoidable and leads to premature contamination of optics projection systems. In this work, we present an experimental methodology aiming at resist outgassing qualification. A specific experimental setup was designed to monitor the induced outgassing phenomena by irradiating resist coated on 100mm silicon wafer. The wafer can be exposed through specific silicon micromachined membranes (called mimics) that are representative of the optics projection system usually embedded in real multi e-beam exposure tools. A Quadrupole Mass Spectrometer (QMS) is plugged into the vacuum chamber and enables in-situ analysis of the by-products outgassing. Combining this tool with the Thermo Desorption - Gas Chromatography coupled to Mass Spectroscopy (TD-GC-MS) analysis, we could not only determine the outgassing amount of different resists but also identify all the outgassed by-products and their origin. Finally, the Focus Ion Beam combined to Scanning Electron Microscopy (FIB-SEM) and X-ray Photoelectron Spectroscopy (XPS) characterization techniques were used to determine the contamination layer thickness and elementary composition, respectively. A first process oriented conclusion from this work shows that the use of a thin topcoat layer can considerably reduce the resist outgassing amount and, consequently, the hydrocarbonaceous contamination layer induced on the mimics. The outgassing amount as well as the top-coat efficiency was shown to be mainly dependent on the resist chemical properties. The contamination layer growth was shown to be dependent on e-beam current density and hydrocarbon pressure in the vicinity of the mimics.
机译:在新兴的高真空多电子束曝光工具中,不可避免地会通过抗蚀剂脱气释放含碳物质(前体),并导致光学投影系统的过早污染。在这项工作中,我们提出了一种旨在抵抗除气资格的实验方法。设计了一个特定的实验装置,以通过辐照涂在100mm硅片上的抗蚀剂来监控诱发的脱气现象。晶片可以通过特定的硅微机械膜(称为模拟物)进行曝光,该膜代表通常嵌入在实际多电子束曝光工具中的光学投影系统。将四极质谱仪(QMS)插入真空室中,并能够对副产物除气进行原位分析。将此工具与热脱附-气相色谱与质谱分析(TD-GC-MS)结合使用,我们不仅可以确定不同抗蚀剂的除气量,还可以确定所有除气副产物及其来源。最后,聚焦离子束结合扫描电子显微镜(FIB-SEM)和X射线光电子能谱(XPS)表征技术分别用于确定污染层的厚度和元素组成。从这项工作得出的第一个以过程为导向的结论表明,使用薄的面漆可以显着减少抗蚀剂的除气量,从而减少模拟物上引起的含烃污染层。放气量以及面涂层效率显示出主要取决于抗蚀剂化学性质。结果表明,污染物层的增长取决于模拟物附近的电子束电流密度和碳氢化合物压力。

著录项

  • 来源
    《Alternative lithographic technologies VI》|2014年|90492Q.1-90492Q.11|共11页
  • 会议地点 San Jose CA(US)
  • 作者单位

    STMicroelectronics, 850 Rue Jean Monnet, Crolles, F-38920, France,CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France,LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;

    CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France;

    CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France;

    CEA, LETI, SiliconTechnology Division, F-38054 Grenoble, France;

    Canon Inc., 23-10 Kiyohara-Kogyodanchi, Utsunomiya city, 321-3298, Japan;

    Canon Inc., 23-10 Kiyohara-Kogyodanchi, Utsunomiya city, 321-3298, Japan;

    MAPPER Lithography, Computerlaan 15, 2628 XK Delft, The Netherlands;

    LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;

    LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;

    LTM-CNRS-UJF/CEA-Leti-Minatec, 17 rue des Martyrs, F-38054 Grenoble, France;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    E-beam resist; Outgassing; Contamination; Top coat; TD-GC-MS; QMS; XPS; FIB-SEM;

    机译:电子束抗蚀剂;放气;污染;面漆TD-GC-MS;质量管理体系XPS;扫描电镜;

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号