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Resist methods and materials for UV and electron-beam lithography with reduced outgassing
Resist methods and materials for UV and electron-beam lithography with reduced outgassing
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机译:用于减少脱气的UV和电子束光刻的抗蚀剂和材料
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摘要
The present invention pertains to polymeric compositions useful for the suppression or elimination of outgassing of volatile components generated from photoresist polymers during lithographic construction. In resists of the invention, an aromatic compound is mixed with a photoresist composition, such that the aromatic compound suppresses or eliminates outgassing of volatile components upon exposure of the resist to radiation. The aromatic additive is preferably an aromatic polymer and in at least some instances can be substituted with at least one electron-donating group or electron-withdrawing group to enhance its stabilizing effects. In one embodiment, the aromatic compound can be an additive to a resist composition. In another embodiment, the aromatic compound can be incorporated into the polymeric backbone of the resist composition.
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