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Resist methods and materials for UV and electron-beam lithography with reduced outgassing

机译:用于减少脱气的UV和电子束光刻的抗蚀剂和材料

摘要

The present invention pertains to polymeric compositions useful for the suppression or elimination of outgassing of volatile components generated from photoresist polymers during lithographic construction. In resists of the invention, an aromatic compound is mixed with a photoresist composition, such that the aromatic compound suppresses or eliminates outgassing of volatile components upon exposure of the resist to radiation. The aromatic additive is preferably an aromatic polymer and in at least some instances can be substituted with at least one electron-donating group or electron-withdrawing group to enhance its stabilizing effects. In one embodiment, the aromatic compound can be an additive to a resist composition. In another embodiment, the aromatic compound can be incorporated into the polymeric backbone of the resist composition.
机译:本发明涉及用于抑制或消除在光刻构造期间由光致抗蚀剂聚合物产生的挥发性组分的脱气的聚合物组合物。在本发明的抗蚀剂中,将芳族化合物与光致抗蚀剂组合物混合,使得该芳族化合物在抗蚀剂暴露于辐射时抑制或消除挥发性组分的脱气。芳族添加剂优选是芳族聚合物,并且在至少一些情况下可以被至少一个供电子基团或吸电子基团取代以增强其稳定作用。在一实施方案中,芳族化合物可以是抗蚀剂组合物的添加剂。在另一个实施方案中,可以将芳族化合物掺入抗蚀剂组合物的聚合物主链中。

著录项

  • 公开/公告号US6680157B1

    专利类型

  • 公开/公告日2004-01-20

    原文格式PDF

  • 申请/专利权人 MASSACHUSETTS INSTITUTE OF TECHNOLOGY;

    申请/专利号US20000687189

  • 发明设计人 THEODORE H. FEDYNYSHYN;

    申请日2000-10-12

  • 分类号G03F70/04;

  • 国家 US

  • 入库时间 2022-08-21 23:14:29

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