首页> 外文会议>2019年第66回応用物理学会春季学術講演会講演予稿集 >Characterization of a GaN wafer and a homo-epitaxial layer by synchrotron X-ray topography techniques
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Characterization of a GaN wafer and a homo-epitaxial layer by synchrotron X-ray topography techniques

机译:通过同步加速器X射线形貌技术表征GaN晶片和同质外延层

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We have investigated the crystal quality of the 2 and 4-inch GaN wafer and homo-epitaxial layer bymonochromatic X-ray diffraction topography. GaN (11-24) diffraction images at various incidentangles were obtained to determine the image of maximum intensity and full-width at half-maximum(FWHM). [1-3] In addition, we have investigated the local structures of a GaN substrate through anenergy-resolved white X-ray diffraction topography method. A section topography geometry wasimplemented at various sample positions for the purpose of wafer mapping. The obtained images ateach position were piled up for the 3D matrix then sliced at a same energy position. The sliced imagesof the lower and higher diffraction energy showed periodic bottom-less and top-less featuresoriginated from the local lattice tilting, respectively.
机译:我们通过单色X射线衍射形貌研究了2英寸和4英寸GaN晶片和同质外延层的晶体质量。获得了各种入射角下的GaN(11-24)衍射图像,以确定最大强度和半峰全宽下的图像(FWHM)。 [1-3]另外,我们通过能量分辨的白色X射线衍射形貌方法研究了GaN衬底的局部结构。为了晶片映射的目的,在各种样品位置实现了截面的几何形状。为每个3D矩阵堆积在每个位置处获得的图像,然后在相同的能量位置处进行切片。较低和较高衍射能量的切片图像\ r \ n分别显示出周期性的无底和无顶特征\ r \从局部晶格倾斜中产生。

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