首页> 外文会议>2008 International Workshop on Junction Technology(第六届结技术国际研讨会) >High-power SiGe Heterojunction Bipolar Transistor(HBT)with multiple emitter fingers
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High-power SiGe Heterojunction Bipolar Transistor(HBT)with multiple emitter fingers

机译:具有多个发射极指的大功率SiGe异质结双极晶体管(HBT)

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摘要

High-power SiGe HBTs with multiple emitter fingers are developed by using interdigitated structure and each emitter stripe area of 3×45μm2. The value of collector-emitter voltage Vce is carefully selected to ensure these power devices operating at high power levels. Four-Watt RF power with maximum high power-added efficiency (PAE) of 49% and power gain(Gp) of 6.71dB is achieved when SiGe HBTs operate at frequency of 900 MHz and Vce of 12V. The devices have emitter power linear density achieved as high as 1.47W/mm and the RF power density is 1.6W/μm2. The power performance of these devices under different bias conditions are also studied. These results set a benchmark for high power performance of the devices and show the great potential of SiGe HBTs for RF high-power amplifications.
机译:采用叉指结构,每个发射条带面积为3×45μm2,开发了具有多个发射极指的高功率SiGe HBT。精心选择集电极-发射极电压Vce的值,以确保这些功率器件在高功率电平下工作。当SiGe HBT以900 MHz的频率和12V的Vce工作时,可实现具有49%的最高高功率附加效率(PAE)和6.71dB的功率增益(Gp)的四瓦RF功率。这些器件的发射器功率线性密度高达1.47W / mm,RF功率密度为1.6W /μm2。还研究了这些器件在不同偏置条件下的功率性能。这些结果为设备的高功率性能树立了标杆,并显示了SiGe HBT在RF大功率放大方面的巨大潜力。

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  • 会议地点 Shanghai(CN)
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    College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100022, China;

    College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100022, China;

    College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100022, China;

    College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100022, China;

    College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100022, China;

    College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100022, China;

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