Low-k and High Thermal Stable Fluorinated Epoxy Materials For Advanced Microelectronic Packaging Applications

摘要

A novel fluorinated epoxy resin, l,l-bis(4-glycidylesterphenyl)-1 -(3-trifluoro-methylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized and cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4'-diaminodiphenyl-methane (DDM). As comparison, commercial available bisphenol-A type epoxy resin (BADGE) was cured by the same curing agent. It was showed that the cured epoxy resins showed good thermal stability and good mechanical properties. The cured epoxy resins also exhibited lower dielectric constants and water absorption than those of nonfluorinated epoxy. Clearly, the fluorinated epoxy resins have decreased the dielectric properties and water absorption due to the introduction of the CF_3 groups in the epoxy resin backbone, compared with the nonfluorinated epoxy.