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Thermally conducting materials and applications for microelectronic packaging
Thermally conducting materials and applications for microelectronic packaging
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机译:导热材料及其在微电子封装中的应用
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摘要
A conductive paste structure is is disclosed which is a combination of a polymeric material and particles, e.g. Cu, having a thermally conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The conductive paste structure is disposed between two thermally conductive surfaces, e.g.chip and substrate pads, to provide thermal interconnection and adhesion between their pads.
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