Temperature dependence of the thermal conductivity of materials for microelectronic packaging: Measuring and modelling effects of microstructure and impurities.

摘要

The materials studied in this research, having a wide range of thermal conductivities, permit a study of the mechanisms which affect their behavior. Data on the thermal conductivity of several substrate materials, over a wide temperature range, were analyzed using the Klemens model. Parameters in this model, which include crystallite size ad impurity concentration, are determined through a nonlinear least squares fitting routine. 8 refs., 6 figs., 1 tab.