Adhesion of Plastic Ball Grid Array Packages on Thick Film Circuits

机译：塑料球栅阵列封装在厚膜电路上的附着力

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An investigation into the design, manufacture and reliability of thick film circuits usingrnplastic ball grid array packages. The information gained from this study was used to assessrnthe suitability of a model for Failure Load Prediction of the adhesion of ball grid arrayrnpackages on thick film circuits.

机译：研究使用塑料球栅阵列封装的厚膜电路的设计，制造和可靠性。从这项研究中获得的信息用于评估模型的适用性，该模型适用于对厚膜电路上的球栅阵列封装的粘附力进行失效载荷预测。

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来源
《12th European microelectronics amp; packaging conference (IMAPS EUROPE '99)》|1999年|p.1-5|共5页
会议地点 Harrogate(GB);Harrogate(GB)
作者
H. Patel; K.J.Williams; A. Curley; T. Lee;
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作者单位

Hybrid Microelectronics Group, School of Computer Science and Electronic Systems, Faculty of Technology, Kingston University, Kingston upon Thames, Surrey;

rnHybrid Microelectronics Group, School of Computer Science and Electronic Systems, Faculty of Technology, Kingston University, Kingston upon Thames, Surrey;

rnHybrid Microelectronics Group, School of Computer Science and Electronic Systems, Faculty of Technology, Kingston University, Kingston upon Thames, Surrey;

rnHybrid Microelectronics Group, School of Computer Science and Electronic Systems, Faculty of Technology, Kingston University, Kingston upon Thames, Surrey Wykeham Farrance Int. Ltd.;

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原文格式 PDF
正文语种 eng
中图分类封装及散热问题;
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Adhesion of Plastic Ball Grid Array Packages on Thick Film Circuits

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