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Characterization of Glass Insulating Thick Films with Ag Conductors for Multilayer Packages

机译:用AG导体对多层包装玻璃绝缘厚膜的表征

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摘要

In this paper, an insulating film was successfully prepared by sintering 35 wt % CaO-15 wt % Al2O3-10 wt % B2O3-40 wt % SiO2 glass at 875 °C. After sintering, the main component of the insulating film was glass-ceramics. The main crystal phase was CaAl2Si2O8, and the crystallization activation energy was 189.76 kJ/mol. After preparing the insulating film, its color turned yellow, and the diffusion of Ag was found by XPS and XRD data. When the temperature increased to 875 °C, the color of the insulating film became lighter, and the silver content decreased. The adhesion of the multilayer structure could reach 875 N. The dielectric constant of the insulating film in the multilayer structure was approximately 5, and the dielectric loss was 0.0011. After sintering, the dielectric strength of the insulating film could reach 13.11 kV/mm, which fully meets the requirements of a complex packaging structure.
机译:在本文中,通过在875℃下烧结35wt%CNA-15wt%Al 2 O 3 -10wt%B2O3-40wt%SiO 2玻璃,成功制备了绝缘膜。烧结后,绝缘膜的主要成分是玻璃陶瓷。主要晶相是CaAL2SI2O8,结晶活化能量为189.76 kJ / mol。在制备绝缘膜后,其颜色变为黄色,并且通过XPS和XRD数据发现AG的扩散。当温度增加到875°C时,绝缘膜的颜色变得更轻,并且银含量降低。多层结构的粘附可以达到875n.多层结构中的绝缘膜的介电常数约为5,介电损耗为0.0011。在烧结之后,绝缘膜的介电强度可以达到13.11kV / mm,这完全满足复杂包装结构的要求。

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