FLOW PATH ASSEMBLY, VALVE DEVICE, FLUID CONTROL DEVICE, SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD USING SAID FLOW PATH ASSEMBLY

摘要

A first flow path member has a first sealing surface for supporting one end surface, in a central axis direction, of an annular seal member, and a second flow path member has a second seal surface including a flat surface for supporting a surface of a plate-like member, and a third seal surface for supporting an outer peripheral surface of the annular seal member, wherein: in the annular seal member, an other end surface of the annular seal member is pressed against the back surface of the plate-like member, the one end surface of the annular seal member is pressed against the first seal surface of the first flow path member, and the outer peripheral surface of the annular seal member is pressed against the third seal surface of the second flow path member; and the plate-like member is pressed by the other end surface of the annular seal member.