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PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLADIUM-COATED COPPER BONDING WIRE, SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD THEREOF
PALLADIUM-COATED COPPER BONDING WIRE, MANUFACTURING METHOD OF PALLADIUM-COATED COPPER BONDING WIRE, SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD THEREOF
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机译:镀钯铜键合线,镀钯铜键合线的制造方法,使用该键合线的半导体器件,及其制造方法
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摘要
A palladium-coated copper bonding wire includes: a core material containing copper as a main component; and a palladium layer on the core material, in which a concentration of palladium relative to the entire wire is 1.0 mass % or more and 4.0 mass % or less, and a work hardening coefficient in an amount of change of an elongation rate 2% or more and a maximum elongation rate εmax % or less of the wire, is 0.20 or less.
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