首页> 外国专利> SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, CONTROL METHOD FOR SUBSTRATE PROCESSING DEVICE, AND CONTROL METHOD FOR SUBSTRATE PROCESSING SYSTEM

SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, CONTROL METHOD FOR SUBSTRATE PROCESSING DEVICE, AND CONTROL METHOD FOR SUBSTRATE PROCESSING SYSTEM

机译:基板处理装置,基板处理系统,基板处理装置的控制方法,以及基板处理系统的控制方法

摘要

Provided is a substrate processing apparatus comprising: a substrate support on which a substrate is mounted; a first radio frequency power supply that outputs first radio frequency power with a first frequency to the substrate support; a second radio frequency power supply that outputs second radio frequency power with a second frequency lower than the first frequency to the substrate support; a sensor that detects reflected waves received from the substrate support and a processor that controls the first radio frequency power supply so that an effective power, which is equal to a difference between the power of the reflected waves detected by the sensor and the output power of the first radio frequency power supply, reaches a set value.
机译:提供一种基板处理设备,包括:基板上安装有基板支撑件; 第一射频电源输出具有第一频率的第一射频功率与基板支撑件; 第二射频电源,其输出第二射频功率,其第二频率低于基板支撑的第一频率; 检测从基板支撑件接收的反射波的传感器和控制第一射频电源的处理器,使得有效功率等于由传感器检测到的反射波的功率与输出功率之间的差值 第一射频电源,达到设定值。

著录项

  • 公开/公告号US2021305030A1

    专利类型

  • 公开/公告日2021-09-30

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号US202117199001

  • 发明设计人 HIROSHI TSUJIMOTO;IKKO TANAKA;

    申请日2021-03-11

  • 分类号H01J37/32;

  • 国家 US

  • 入库时间 2022-08-24 21:21:46

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