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Advanced Laser Microprocessing for Substrates Microprocessing of Microsystems and Optoelectronics Devices Applications

机译:高级激光微加工,用于微处理微处理和光电子设备应用

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Lasers are an important tool in the fabrication of microsystems like MOEMS and photonic components and in particular their use in scribing for separating LED dies on sapphire substrates. This paper describes scribing and cutting of sapphire and GaN using
机译:激光器是制造MoEMS和光子元件等微系统的重要工具,特别是在蓝宝石基板上划线划线时使用。本文介绍了蓝宝石和GaN的划线和切割

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