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首页> 外文期刊>Laser Focus World: The Magazine for the Photonics & Optoelectronics Industry >High-rate laser microprocessing handles large-area substrates
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High-rate laser microprocessing handles large-area substrates

机译:高速激光微处理处理大面积基板

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摘要

The combination of high-power (or high-average power) lasers and high-speed scanning systems processes large substrates quickly and accurately. High-rate laser microprocessing is becoming a key enabling technology for modern microfabrication and production. Recent high-rate machining technology combines the advantages of high-power lasers and high-speed processing. The primary goal is to bring innovative and well-established laser micromachining processes from the lab to the industry to enhance productivity, processing speed, and throughput. This becomes possible, on the one hand, by recent progress in the development of laser sources supplying hundreds to thousands of watts of laser power with excellent beam quality, as well as high-average-power ultrafast lasers. Ultrafast scan systems, another core feature for high-rate machining, can avoid thermal damage to the substrates, even at high laser powers, by deflecting the laser beams at unprecedented speeds.
机译:高功率(或高平均功率)激光器和高速扫描系统的组合快速准确地处理大型基板。 高速激光微处理正在成为现代微制造和生产的关键能力技术。 最近的高速加工技术结合了大功率激光器和高速处理的优点。 主要目标是从实验室带来创新和完善的激光微机械加工过程,以提高生产力,加工速度和吞吐量。 一方面,这是可能的,通过最近的激光源的开发进展,这些进展提供数百到数千辆的激光功率,具有优异的光束质量,以及高平均功率超快激光器。 超快扫描系统,用于高速加工的另一个核心特征,即使在高激光功率下,也可以避免对基板的热损坏,通过以前所未有的速度偏转激光束。

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