Process for the manufacture of metallic objects formed of layers of different alloys

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• 2. 一种使物体在离子渗入时不同表面形成不同渗层的方法及装置 [P] . 中国专利： CN101343725A . 2009-01-14
• 3. Process for the manufacture of metallic objects formed by layers of different natures [P] . 法国专利： FR473435A . 1915-01-12

  机译： 用于制造由不同性质的层形成的金属物体的方法

• 4. Magnesium object or its alloys, process for forming a conversion layer on a magnesium object or its alloys, and using a solution for the preparation of an object [P] . BR0006920A . 2001-11-13

  机译： 镁物体或其合金，在镁物体或其合金上形成转化层的方法，以及使用溶液制备物体的方法

• 5. Semiconductor device manufacturing process, involves depositing metallic layer on surface of structure formed by depositing dielectric layers and low dielectric constant layers, and removing metallic layer by chemical-mechanical polishing [P] . 法国专利： FR2860098A1 . 2005-03-25

  机译： 半导体器件制造工艺涉及在通过沉积介电层和低介电常数层形成的结构的表面上沉积金属层，并通过化学机械抛光去除金属层

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• 3. Investigation of ZrO2 nanoparticles concentration and processing time effect on the localized PEO coatings formed on AZ91 alloy [J] . Zeeshan Ur Rehman, Dongjin Choi 镁合金学报（英文） . 2019,第004期
• 4. Processing the CAD model of sculptured artifacts for free-form thick-layered object manufacturing [C] . Imre Horvath, Zoltan Rusak, Han J. Broek, Computers and Information in Engineering Conference . 2000
• 5. Representation and process planning for layered manufacturing of heterogeneous objects. [D] . Shin, Ki-Hoon. 2002
• 6. Optimizing 3D Printed Metallic Object’s Postprocessing: A Case of Gamma-TiAl Alloys [O] . M. A. K. Chowdhury, AMM Sharif Ullah, Roberto Teti 2021
• 7. Residual stress determination in oxide layers at different length scales combining Raman spectroscopy and X-ray diffraction: Application to chromia-forming metallic alloys [O] . Guerain, Mathieu, Grosseau-Poussard, Jean-Luc, Geandier, Guillaume, 2017
• 8. (abstract) Undercooling Studies of the Bulk Metallic Glass Forming Zr(sub 41.2)Ti(sub 13.8)Cu(sub 12.5)Ni(sub 10.0)Be(sub 22.5) Alloy During Containerless Electrostatic Levitation Processing [R] . Kim, Y. J., Busch, R., Johnson, W. L., 1995

• 1. Effect of different processing methods for the hole transporting layer on the performance of double layer organic light-emitting devices [J] . SU0 Fan YUJun-sheng DENG Jing LOUShuang-ling JIANGYa-dong . 光电子快报：英文版 . 2007,第4期
• 2. Diffusion Carbide Layers, Formed on the Surface of Steel in the Vacuum Titanizing Process [J] . KASPRZYCKA Ewa ,SENATORSKI Jan ,NAKONIECZNY Aleksander . 材料热处理学报 . 2004,第05B期
• 3. 金属化层表面状况的不同处理方法对陶瓷金属封接强度的影响 [C] . 张振霞 ,李秀霞 ,韩勇 . 2011年度真空电子材料、陶瓷-金属封接与真空开关管用陶瓷管壳技术研讨会 . 2011
• 4. 金属合金摩擦层的形成、作用及机理研究 [A] . 张秋阳 . 2016