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Method for etching silicon wafers using a potassium hydroxide and water etching solution
Method for etching silicon wafers using a potassium hydroxide and water etching solution
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机译:使用氢氧化钾和水蚀刻溶液蚀刻硅晶片的方法
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摘要
A method for etching silicon wafers having a (100) or (110) crystallographic orientation. The method includes using an etching solution consisting essentially of potassium hydroxide (KOH) and water. This allows for an optimum combination of etch rate and etch quality.
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