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SEMICONDUCTOR DEVICE IN WHICH ELEMENTS ARE ISOLATED AND METHOD OF ISOLATING ELEMENTS FOR SEMICONDUCTOR DEVICE

机译:隔离了半导体元件中的半导体器件的方法和隔离元件的方法

摘要

PURPOSE:To form an element protected from invasion of implanted ions and maintaining excellent electric characteristics by a method wherein the element formed in a compound semiconductor substrate and an ion implanted region are separated from each other by a compound semiconductor region into which ions are not implanted. CONSTITUTION:A resistance layer 2 with a width of a 2 mum is formed in a GaAs substrate 1 by ion implantation. Then a resist film is applied to the substrate 1 exposed and developed to form a resist pattern 3 which covers the surface of the resistance layer 2 and is wider than the resistance layer 2 by about 1 mum outward. Then, from the above of the substrate, B+ ions are implanted to form an insulated ion implanted region 4 with a little distance from the resistance layer 2. Then the resist pattern 3 is removed. Although the distance between the resistance layer 2 and the insulated ion implanted region 4 is reduced to some extent by various treatments in a semiconductor device manufacturing process, the insulated ion implanted region 4 never invades the resistance layer 2.
机译:用途:通过以下方法形成一种保护免受注入离子入侵的元素并保持出色的电性能的方法:在化合物半导体衬底中形成的元素与离子注入区域之间通过不注入离子的化合物半导体区域彼此分开。组成:通过离子注入在GaAs衬底1上形成宽度为2μm的电阻层2。然后,将抗蚀剂膜施加到暴露并显影的基板1上,以形成抗蚀剂图案3,该抗蚀剂图案3覆盖电阻层2的表面并且比电阻层2宽约1μm向外。然后,从衬底的上方注入B +离子以形成与电阻层2相距很小距离的绝缘离子注入区4。然后去除抗蚀剂图案3。尽管在半导体器件制造过程中通过各种处理使电阻层2与绝缘离子注入区4之间的距离有所减小,但是绝缘离子注入区4从不侵入电阻层2。

著录项

  • 公开/公告号JPS63278245A

    专利类型

  • 公开/公告日1988-11-15

    原文格式PDF

  • 申请/专利权人 SUMITOMO ELECTRIC IND LTD;

    申请/专利号JP19870113246

  • 发明设计人 MIKAMURA YASUKI;

    申请日1987-05-09

  • 分类号H01L21/76;

  • 国家 JP

  • 入库时间 2022-08-22 06:45:29

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