lead frame for a semiconductor element, lead frame and a semiconductor device for a semiconductor element with resin, as well as lead for the semiconductor element method of manufacturing the frame, the manufacturing method of a method of manufacturing a semiconductor device and a lead frame for a semiconductor element with resin

摘要

PROBLEM TO BE SOLVED: To provide a lead frame inhibiting the formation of foreign objects which impair the reliability.;SOLUTION: A lead frame 10 includes: a frame body 13 including a front surface 13a, a rear surface 13b, and an outer side surface 13c; and multiple unit lead frames 14 disposed in the frame body 13 in a multi-surface form (a matrix form), the multiple unit lead frames, each having a die pad 25 on which a semiconductor element 21 is placed and a lead part 26 separated from the die pad 25. The outer side surface 13c of the frame body 13 has a front surface side region 15 and a rear surface side region 16 that extend in the peripheral edge direction. Multiple front surface side recessed parts 17 are provided on the front surface side region 15 along the peripheral edge direction, and multiple rear surface side recessed parts 18 are provided on the rear surface side region 16 along the peripheral edge direction. Each front surface side recessed part 17 is formed from the outer side surface 13c of the frame body 13 to the front surface 13a, and each rear surface side recessed part 18 is formed from the outer side surface 13c of the frame body 13 to the rear surface 13b.;COPYRIGHT: (C)2013,JPO&INPIT