A process for forming a vapor-phase epitaxial growth layer on a silicon wafer having a buried layer of a high As or B concentration. This vapor-phase epitaxial growth process is performed in two steps of (i) performing a vapor-phase epitaxial growth at a relatively low temperature by using a reaction gas containing at least one kind selected from a group consisting of SiHxF4-x (x = 0 to 3) and Si₂HxF6-x (x = 0-5) and at least one kind selected from a group consisting of SiH₄ and Si₂H₆, and (ii) performing a vapor-phase epitaxial growth under a condition which allows a higher growth rate that in the step (i) by using a reaction gas containing SiH₄ or Si₂H₆ which may or may not be accompanied with silane fluoride.
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机译:在具有高As或B浓度的掩埋层的硅晶片上形成气相外延生长层的方法。该气相外延生长工艺分两个步骤进行:(i)通过使用包含选自SiHxF4-x的至少一种的反应气体在较低的温度下进行气相外延生长(x = 0至3)和Si 2 H x F 6 -x(x = 0-5)和选自SiH 3和Si 2 H 3中的至少一种,以及(ii)在允许较高生长速率的条件下进行气相外延生长。在步骤(i)中,通过使用含有SiH 3或Si 2 H 3的反应气体,该反应气体可以或可以不与氟化硅烷一起伴随。
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