IC CHIPS WITH SELF-ALIGNED THIN FILM RESISTORS

摘要

the present invention relates to a process for the manufacture of an integrated circuit chip with thin film resistors, as well as the integrated circuit chips are manufactured according to such a process.in the method, a substrate is first coated with a chip layers of thin film material, and a barrier layer for interconnection between layers if necessary), were attacked in a predetermined region on the basis of the mu00e9talliq interconnection structure eu, the material layer being aligned vertically and in a section of the remaining material.the connecting material, and the material barrier if there is attacked, exposing the material layer to form a thin film resistor is aligned with the conductors of adjacent sections are interconnected. the material in the predetermined region can be attacked by a dry or wet (plasma).