Half bridge device package, packaged devices and circuits

摘要

A package for a two-switching-device half bridge circuit comprises an insulating substrate having first, second and third external power terminals along with control terminals bonded to the substrate. The power terminals are configured to provide a straight-through-the package current path from the first external power terminal to the second or common external power terminal and from the second or common external power terminal to the third external power terminal. The control terminals are preferably Kelvin terminal pairs in order to minimize feedback from the power current paths to the control circuits. The power devices are preferably bonded to the first external power terminal and the second external power terminal, respectively, with their connections respectively to the second power terminal and third power terminal substantially identical in order to provide power current paths through the package having substantially identical electrical and thermal impedances. This half bridge package is appropriate for use in high performance, high frequency, half bridge circuits.