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Method and a system for assisting mending of a semiconductor integrated circuit, and a wiring structure and a wiring method suited for mending a semiconductor integrated circuit
Method and a system for assisting mending of a semiconductor integrated circuit, and a wiring structure and a wiring method suited for mending a semiconductor integrated circuit
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机译:辅助修补半导体集成电路的方法和系统,以及适用于修补半导体集成电路的布线结构和布线方法
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摘要
A method and a system for assisting mending of an LSI after it has been formed into a chip which is necessitated by modification of logic etc. The mending includes corrections by connecting or cutting interconnections of the LSI. The assisting method and system provides a method and a system for detecting which interconnection or connections should be subjected to mending according to the logic modification, or a method and a system for detecting an area or areas where the intended mending can be carried out, or a method and a system for advising a mending-allowable rate of the LSI. This invention further provides a wiring structure suited for mending of the LSI and a wiring method for the same. By this method, a wiring structure which preliminarily has a mending area in preparation for possible modification in logic is produced.
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