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An enhancement/depletion process for III-V compound semiconductor heterostructure field-effect transistors and optoelectronic integrated circuits.

机译:III-V化合物半导体异质结构场效应晶体管和光电集成电路的增强/耗尽工艺。

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摘要

Intense material and device research aimed toward high-speed digital circuits and optoelectronic integrated circuits (OEICs) has focused on III-V compound semiconductors such as GaAs-based and InP-based materials because of their superior electronic properties over those of silicon. Recent advances in the fields of Molecular Beam Epitaxy (MBE), Organometallic Vapor Phase Epitaxy (OMVPE), as well as device and circuit fabrication have made large-scale integration (LSI) using III-V compound semiconductor devices possible. This thesis describes an enhancement/depletion (E/D) process that utilizes modulation-doped field-effect transistors (MODFETs) and direct-coupled FET logic (DCFL) technology. The potential of this process for high-speed, high-density applications for LSI digital integrated circuits as well as optoelectronic circuits is demonstrated through the fabrication of the DCFL ring oscillators and the OEIC transimpedance receivers.; The success of this E/D process can be attributed to the selective wet etch process using citric acid:{dollar}rm Hsb2{dollar}O{dollar}sb2{dollar} solutions in conjunction with the introduction of the AlAs etch stop layers in the MODFET heterostructures. Extremely uniform device characteristics such as threshold voltage, extrinsic transconductance, and current-gain cutoff frequency have been achieved using citric acid:{dollar}rm Hsb2Osb2{dollar} solutions for gate recessing.; Discrete E/D MODFETs in both GaAs/InGaAs/AlGaAs and InP/InGaAs/InAlAs material systems exhibit good dc and high-frequency characteristics. Ring oscillators and OEIC receivers are fabricated successfully using this E/D process. The circuit yield is high. The ring oscillators exhibit a best gate delay of 13 ps, and the receivers show a bandwidth of greater than 3 GHz at a transimpedance gain of 50 dB. A maximum gain-bandwidth product of 2 THz{dollar}cdotOmega{dollar} is achieved for the receivers.
机译:面向高速数字电路和光电集成电路(OEIC)的大量材料和器件研究已将重点放在III-V型化合物半导体上,例如GaAs基和InP基材料,因为它们的电子性能优于硅。分子束外延(MBE),有机金属气相外延(OMVPE)以及器件和电路制造领域的最新进展使得使用III-V型化合物半导体器件进行大规模集成(LSI)成为可能。本文介绍了一种增强/耗尽(E / D)工艺,该工艺利用了调制掺杂的场效应晶体管(MODFET)和直接耦合FET逻辑(DCFL)技术。通过制造DCFL环形振荡器和OEIC跨阻接收器,证明了该工艺在LSI数字集成电路以及光电电路的高速,高密度应用中的潜力。此E / D工艺的成功可归因于使用柠檬酸的选择性湿法蚀刻工艺:{$} rm Hsb2 {dollar} O {dollar} sb2 {dollar}解决方案以及在Al中引入AlAs蚀刻停止层MODFET异质结构。使用柠檬酸可实现极均匀的器件特性,例如阈值电压,非本征跨导和电流增益截止频率:用于栅极凹进的柠檬酸溶液:{rm} Hsb2Osb2 {dollar}溶液; GaAs / InGaAs / AlGaAs和InP / InGaAs / InAlAs材料系统中的离散E / D MODFET都具有良好的直流和高频特性。使用此E / D工艺成功制造出环形振荡器和OEIC接收器。电路成品率高。环形振荡器的最佳栅极延迟为13 ps,接收器的跨阻增益为50 dB时,其带宽大于3 GHz。接收器的最大增益带宽积为2 THz {dollar} cdotOmega {dollar}。

著录项

  • 作者

    Tong, Minh Ho.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1992
  • 页码 174 p.
  • 总页数 174
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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