A novel temperature analysis method for compound semiconductor integrated circuits based on iterative algorithm

摘要

A novel temperature analysis method for compound semiconductor integrated circuits based on iteration algorithm has been presented. The iteration algorithm has been developed with efficient numerical calculation in MATLAB. This method has been applied to a simple module including 9 devices and the calculated temperature distribution has been compared to the simulated result by 3D simulation tool. The obtained results demonstrate that the novel algorithm has the ability to calculate the junction temperature of the devices in a compound semiconductor integrated circuit with high accuracy, high speed and low computation.