Method for applying solder to printed wiring boards and printed wiring board to which solder has been applied

摘要

A method for applying solder to printed wiring boards includes producing a printed wiring board with electrically conductive regions. Soldering paste is applied as a solder deposit on the electrically conductive regions. The solder deposits are melted to form hump-shaped solid solder applications joined to the printed wiring board. The hump- shaped solder applications are levelled out by areally applying pressure to the solder applications in the direction of the printed wiring board. A printed wiring board to which solder has been applied includes a wiring board surface having regions to be equipped with components according to an SMD process. Solder applications are disposed on the regions in the form of a solid solder layer. The solid solder layer has a pressed or rolled surface extended substantially parallel to the wiring board surface.