首页> 外国专利> METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, WIRE, SOLDERED PRODUCT, FLEXIBLE PRINTED BOARD, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING TIN ARTICLE, METHOD FOR MANUFACTURING TIN INTERMEDIATE PRODUCT, TIN INTERMEDIATE PRODUCT, AND CONDUCTIVE MEMBER

METHOD FOR MANUFACTURING SOLDER PRODUCT, SOLDER, SOLDERED COMPONENT, PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, WIRE, SOLDERED PRODUCT, FLEXIBLE PRINTED BOARD, ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING TIN ARTICLE, METHOD FOR MANUFACTURING TIN INTERMEDIATE PRODUCT, TIN INTERMEDIATE PRODUCT, AND CONDUCTIVE MEMBER

机译:制造焊料产品,焊料,焊接部件,印刷配线板,印刷电路板,电线,焊接产品,柔性印刷板,电子元件,制造锡制品的方法,制造锡中间产品,锡中间产品和导电方法的方法 成员

摘要

A solder product 20 includes: a lead-free solder part 21 containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product 20 to form a surface layer 22. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.
机译:焊料产品20包括:含有锡作为主要成分的无铅焊料部分21和除铅之外的金属元素作为次级组分; 和具有10至20个碳的羧酸,羧酸主要分布在焊料施用产品20的表面上以形成表面层22.羧酸优选是具有12至16个碳的脂肪酸,更优选棕榈酸 酸。

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