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Method of coating circuit paths on printed circuit boards with solder Patent

机译：用焊料涂覆印刷电路板上的电路路径的方法

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Solder coating process for printed copper circuit protection

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作者
Wittmann, A. E.;
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年度 1967
页码 1-5
总页数 5
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
CIRCUIT PROTECTION; COATING; PRINTED CIRCUITS; SOLDERS; CIRCUIT BOARDS; COPPER; DIPPING; SPIN;

机译：电路保护;涂层;印刷电路;焊料;电路板;铜;浸渍; spIN;

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专利

1. Effect of solder flux residue on the performance of silicone conformal coatings on printed circuit board assemblies [J] . U. Rathinavelu, M. S. Jellesen, R. Ambat Corrosion Engineering, Science and Technology . 2013,第6期

机译：助焊剂残留量对印刷电路板组件上的有机硅保形涂料性能的影响
2. Allergic contact dermatitis from epoxy resin in solder mask coating in an individual working with printed circuit boards. [J] . Wenk KS, Ehrlich A Dermatitis: contact, atopic, occupational, drug : official journal of the American Contact Dermatitis Society, North American Contact Dermatitis Group . 2010,第5期

机译：在与印刷电路板一起工作的个体中，由环氧树脂在阻焊膜涂层中引起的过敏性接触性皮炎。
3. A signal path grouping algorithm for fast detection of short circuits on printed circuit boards [J] . Yiu-Wing Leung IEEE Transactions on Instrumentation and Measurement . 1994,第1期

机译：用于快速检测印刷电路板上短路的信号路径分组算法
4. Prognostic health monitoring method for fatigue failure of solder joints on printed circuit boards based on a canary circuit [C] . Kenji HIROHATA, Yousuke HISAKUNI, Takahiro OMORI, ASME international mechanical engineering congress and exposition . 2014

机译：基于金丝雀电路的印制电路板焊点疲劳失效的预后健康监测方法
5. A fast method for computing current distribution on printed circuit boards and microwave integrated circuits using the method of moments. [D] . Jevremovic, Vladan. 1999

机译：一种使用矩量法计算印刷电路板和微波集成电路上电流分布的快速方法。
6. Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames [O] . Ting Yin, Nan Xiang, Guangxin Wang, 2020

机译：在电路引线框架上制造可焊锡涂层的最佳热浸镀锡工艺程序
7. Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating [O] . Conseil Helene, Jellesen Morten Stendahl, Ambat Rajan 2014

机译：印刷电路板组件的污染特性与焊接类型和保形涂层有关

Method of coating circuit paths on printed circuit boards with solder Patent

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