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Vacuum system of semiconductor device etching equipment and its operating method

机译:半导体器件蚀刻设备的真空系统及其操作方法

摘要

The present invention relates to a vacuum system for etching devices of semiconductor devices, comprising a TMP (Turbomolecular Pump) (hereinafter referred to as TMP) 4 for pumping a transfer chamber 3, a transfer chamber 3 for pumping a cassette chamber 1, A rotary vane pump 6 which is simultaneously connected to the TMP pump 4 for pumping the process chamber 2 to discharge the pumping effluent and a TMP pump 5 for pumping the process chamber 2 And an RVP pump (7) connected to the TMP pump (5) to discharge the pumping effluent. The present invention relates to a vacuum system for a semiconductor device etching equipment and a method of operating the same.
机译:技术领域本发明涉及一种用于半导体器件的蚀刻装置的真空系统,其包括用于泵送传送室3的TMP(涡轮分子泵)(以下称为TMP)4,用于泵送盒室1的传送室3,旋转装置。叶片泵6和RMP泵7分别与用于泵送处理室2以排出泵送废水的TMP泵5和用于泵送处理室2的TMP泵5相连,RVP泵7与TMP泵5相连。排放抽水。本发明涉及一种用于半导体器件蚀刻设备的真空系统及其操作方法。

著录项

  • 公开/公告号KR940020492A

    专利类型

  • 公开/公告日1994-09-16

    原文格式PDF

  • 申请/专利权人 김주용;

    申请/专利号KR19930001636

  • 发明设计人 박철수;이상윤;성노영;이재근;

    申请日1993-02-06

  • 分类号H01L21/302;

  • 国家 KR

  • 入库时间 2022-08-22 04:37:28

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