The present invention relates to a vacuum system for etching devices of semiconductor devices, comprising a TMP (Turbomolecular Pump) (hereinafter referred to as TMP) 4 for pumping a transfer chamber 3, a transfer chamber 3 for pumping a cassette chamber 1, A rotary vane pump 6 which is simultaneously connected to the TMP pump 4 for pumping the process chamber 2 to discharge the pumping effluent and a TMP pump 5 for pumping the process chamber 2 And an RVP pump (7) connected to the TMP pump (5) to discharge the pumping effluent. The present invention relates to a vacuum system for a semiconductor device etching equipment and a method of operating the same.
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