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CUTTING-OFF OF HOOPLIKE LEAD FRAME FOR ELECTRONIC COMPONENT MANUFACTURE AND SENDING-OUT DEVICE
CUTTING-OFF OF HOOPLIKE LEAD FRAME FOR ELECTRONIC COMPONENT MANUFACTURE AND SENDING-OUT DEVICE
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机译:电子零件制造与引出装置的HOOPLIKE铅框架的切除
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摘要
PURPOSE: To cut off a hooplike lead frame that is transferred in the longitudinal direction, on its way and realize the forward transfer of the front leadframe alone as it is, that is at the front further than the cut piece, while the sure and smooth forward sending out of the rear lead frame that is at the rear further than the cut place, is realized. ;CONSTITUTION: A transfer mechanism 14 to transfer a hooplike lead frame 1 and the cutting-off mechanism 15 of the lead frame 1 are provided forward and backward in regard to the transfer direction of the lead frame 1, and when the transfer of the lead frame 1 by the transfer mechanism 14 is stopped, the cutting-off mechanism 15 is operated to conduct cutting-off, and after the cutting-off operation, the transfer of the lead frame 1 by the transfer mechanism 14 is resumed. The sending-out roller 20 of the lead frame 1 is provided at a plane on this side of a transfer direction further than the cutting-off mechanism 15, and the sending-out roller 20 is rotatingly driven at a peripheral speed that does not exceed the transfer speed of the transfer mechanism 14, and in addition a one-way clutch is provided at a rotation transmitting portion to the sending-out roller 20.;COPYRIGHT: (C)1995,JPO
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